Tim Osswald

Consolidated Papers Foundation Chair sponsored by the Mead Witter Foundation


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1059 Mechanical Engineering Building
1513 University Avenue
Madison, WI 53706

Ph: (608) 263-9538
Fax: (608) 265-2316

Primary Affiliation:
Mechanical Engineering

Additional Affiliations:
Materials Science and Engineering, Rheology Research Center

Profile Summary

Professor Osswald teaches polymer processing, designing with polymers and polymer composites processing. Professor Osswald's research in polymer engineering includes modeling and simulation in polymer processing, engineering design with plastics, sustainability and biopolymers. Professor Osswald is co-Director of the Polymer Engineering Center at the University of Wisconsin-Madison and is Honorary Professor of Plastics Technology at the University of Erlangen-Nuremberg in Germany an the National University of Colombia.  Professor Osswald has published over 100 papers, the books Materials Science of Polymers for Engineers (Hanser, 1996, 2003), Polymer Processing Fundamentals (Hanser 1998), Injection Molding Handbook (Hanser, 2001, 2007) Compression Molding (Hanser, 2003), Polymer Processing Modeling and Simulation (Hanser 2006), International Plastics Handbook (Hanser 2006), and Kunststoff Taschenbuch (Hanser 2007). Professor Osswald is also the series editor of Plastics Pocket Power (Hanser, 2001), which currently includes 6 books.  He serves as faculty advisor to SHPE (Society of Hispanic Professional Engineers) and Theta Tau. Osswald serves as the English Language Editor of The Journal of Plastics Technology, and as an Editor for the Americas of the Journal of Polymer Engineering. Osswald is the 2001 recipient of the VDI-K Dr.-Richard-Escales-Prize. Professor Osswald has served as a consultant to several industries, is one of the co-founders of The Madison Group, and is in the technical and scientific advisory board of several companies. Professor Osswald has also served as an expert witness in polymer engineering litigation, including product failure, as well as patents and intellectual property.

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