My work in plasma etching and plasma depositionincludes both experimental and theoretical studies of several methods of plasma production, with an emphasis on low-pressure RF induction discharges and other "high density" plasma sources. In a study of plasma etching for fabrication of integrated circuits, we are studying the mechanisms of selective etching of SiO2 over silicon in high-density plasma reactors recently developed for large-diameter silicon wafers. We are using mass spectrometry and gas phase optical techniques to determine the chemical identity of neutral and ionic species reaching the substrate, in an effort to understand differences between reactor types. In discharges for protective or barrier coatings on large substrates. We are also investigating processes to deposit barrier coatings on plastic blood containers. Other work includes reactor and process design for flat panel display fabrication and development of diagnostics for depositing discharges. The use of ionized gases for materials processing is a technique now used in a wide array of industries. Understanding of the behavior of the plasmas involved, how they interact with materials substrates and implications for process development is the primary goal of my research, in addition to design of plasma generation systems for new applications.