Daniel van der Weide

Professor

1439 Engineering Hall
1415 Engineering Drive
Madison, WI 53706

Ph: (608) 265-6561
Fax: (815) 371-3407
danvdw@engr.wisc.edu


Profile Summary

My group designs, build and use microfabricated circuits and structures for high frequency probes and sensors with an eye toward cross-disciplinary applications. Though all our instruments work somewhere in the DC-THz frequency range, many are proximal probes, scanned at or very near a sample, while others measure a collective response in the far field, at distances much greater than the wavelengths they use.

Some of the proximal probes are tiny antennas that can be used with scanning probe microscope platforms to make images of an integrated circuit?s topography and local electric or magnetic fields. These same probes can also be used to examine sub-surface defects in materials such as silicon and quartz, excite "artificial molecules" made with semiconductor quantum dots, probe moisture content in paper fibers, and perhaps map out the structure and dynamics of ion channels in neuronal membrane. Other probes using diodes at their tips can be used for imaging local temperature and topography or directly detecting local microwave and optical fields.

The far-field sensors we are developing are based on picosecond-pulse electronic circuits using nonlinear transmission lines and integrated antennas. We are currently using GaAs versions of these circuits for measuring components of automotive exhaust gasses and for making reflection spectra of explosives and weapons for aviation security. We are also designing complete integrated-circuit coherent measurement systems to drive these circuits, and we are investigating less expensive silicon realizations of these sensors and systems.

Finally, we are pursuing ways of sharing these instruments through the Web, using remote-accessed instrumentation for educational outreach and experimental collaboration.

Education

  • PhD EE, Stanford, 1993
  • MS EE, Stanford, 1990
  • BS EE, minor in Latin, University of Iowa, 1987

Research Interests

  • Multifunctional scanned probe microscopy
  • Localized spectroscopy of biological and low-dimensional electronic systems
  • Terahertz circuits and devices

Awards, Honors and Societies

  • Office of Naval Research Young Investigator, 1998
  • National Science Foundation PECASE Award, 1997
  • National Science Foundation CAREER Award, 1997
  • Member, IEEE, APS, MRS, OSA, etc.

Publications

  • D.W. van der Weide, J. Murakowski, and F. Keilmann, \"Gas-absorption spectroscopy with electronic terahertz techniques,\" IEEE Transactions on Microwave Theory and Techniques, vol. 48, pp. 740-43, April 2000.
  • P. Akkaraekthalin, S. Kee and D.W. van der Weide, \"Distributed broadband frequency translator and its use in a 1-3 GHz coherent reflectometer,\" IEEE Transactions on Microwave Theory and Techniques, vol. 46, pp. 2244-50, December 1998.
  • R. H. Blick, D. W. van der Weide, R. J. Haug, and K. Eberl, \"Broadband millimeter-wave response of a double quantum dot,\" Physical Review Letters, vol. 81, pp. 689-92, July 1998.
  • V. Agrawal, P. Neuzil, and D. W. van der Weide, \"Simultaneous probing of microwave magnetic field and topography,\" Applied Physics Letters, vol. 71, pp. 2343-45, 1997.
  • D. W. van der Weide, \"Localized picosecond resolution with a near-field microwave/ scanning-force microscope,\" Applied Physics Letters, vol. 70, pp. 677-9, 1997.
  • D. W. van der Weide and P. Neuzil, \"The nanoscilloscope: Combined topography and AC field probing with a micromachined tip,\" Journal of Vacuum Science & Technology B, vol. 14, pp. 4144-7, 1996.
  • R. H. Blick, R. J. Haug, D. W. van der Weide, K. von Klitzing, and K. Eberl, \"Photon-assisted tunneling through a quantum dot at high microwave frequencies,\" Applied Physics Letters, vol. 67, pp. 3924-6, 1995.

Links

  • Van der Weide Group Site (http://vdw.ece.wisc.edu)

Courses

Fall 2015-2016

  • BME 790 - Master\'s Research and Thesis

  • ECE 699 - Advanced Independent Study
  • ECE 790 - Master\'s Research or Thesis
  • ECE 890 - Pre-Dissertator\'s Research
  • ECE 990 - Research or Thesis
  • ECE 999 - Advanced Independent Study
  • ECE 999 - Advanced Independent Study
  • ECE 990 - Research or Thesis
  • ECE 489 - Honors in Research
  • ECE 890 - Pre-Dissertator\'s Research
  • ECE 790 - Master\'s Research or Thesis
  • ECE 699 - Advanced Independent Study
  • ECE 399 - Independent Study
  • BME 990 - Research and Thesis
  • BME 790 - Master\'s Research and Thesis
  • BME 699 - Advanced Independent Study
  • Profile Summary

    My group designs, build and use microfabricated circuits and structures for high frequency probes and sensors with an eye toward cross-disciplinary applications. Though all our instruments work somewhere in the DC-THz frequency range, many are proximal probes, scanned at or very near a sample, while others measure a collective response in the far field, at distances much greater than the wavelengths they use.

    Some of the proximal probes are tiny antennas that can be used with scanning probe microscope platforms to make images of an integrated circuit?s topography and local electric or magnetic fields. These same probes can also be used to examine sub-surface defects in materials such as silicon and quartz, excite "artificial molecules" made with semiconductor quantum dots, probe moisture content in paper fibers, and perhaps map out the structure and dynamics of ion channels in neuronal membrane. Other probes using diodes at their tips can be used for imaging local temperature and topography or directly detecting local microwave and optical fields.

    The far-field sensors we are developing are based on picosecond-pulse electronic circuits using nonlinear transmission lines and integrated antennas. We are currently using GaAs versions of these circuits for measuring components of automotive exhaust gasses and for making reflection spectra of explosives and weapons for aviation security. We are also designing complete integrated-circuit coherent measurement systems to drive these circuits, and we are investigating less expensive silicon realizations of these sensors and systems.

    Finally, we are pursuing ways of sharing these instruments through the Web, using remote-accessed instrumentation for educational outreach and experimental collaboration.


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